Specialty
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Tensile Modulus 1650 MPa
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Tensile Strength 50 MPa
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Nominal Strain at Break 30”%
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Temperature of Deflection under Load 1.80 MPa 46 °C
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Temperature of Deflection under Load 0.45 MPa 180 °C
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Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
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Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
General Purpose
Augue arcu congue porttitor mauris lorem eget. Vulputate enim fermentum morbi feugiat tincidunt aenean accumsan integer maecenas at risus.
-
Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
-
Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
High Performance
Augue arcu congue porttitor mauris lorem eget. Vulputate enim fermentum morbi feugiat tincidunt aenean accumsan integer maecenas at risus.
-
Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
-
Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
PEKK
Augue arcu congue porttitor mauris lorem eget. Vulputate enim fermentum morbi feugiat tincidunt aenean accumsan integer maecenas at risus.
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Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
-
Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
Support Materials
Augue arcu congue porttitor mauris lorem eget. Vulputate enim fermentum morbi feugiat tincidunt aenean accumsan integer maecenas at risus.
-
Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
-
Tensile Modulus 1650 MPa
-
Tensile Strength 50 MPa
-
Nominal Strain at Break 30”%
-
Temperature of Deflection under Load 1.80 MPa 46 °C
-
Temperature of Deflection under Load 0.45 MPa 180 °C
-
Density 1.03 g/cm³
Highlights
- Strong interlayer adhesion for multi-material prints
- High flexibility with excellent tear resistance
- Ideal for overmolds and soft-touch applications
Typical Applications
- Wearable device enclosures
- Flexible joints and connectors
Optional Preheader
Shop All Materials
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